LevelQuik® Advance is a high-flow, fiber-reinforced self-leveling underlayment that offers the unique advantage of being a versatile solution perfect for all construction and renovation projects. Its compatibility with various substrates, including wood subfloors without the need for lath, concrete, ceramic tile, and existing flooring, makes it an excellent choice for diverse applications. This innovative product eliminates the necessity for additional materials like cement backerboard, simplifying the installation process while ensuring a seamless, flat surface.
Key Features
- Advanced formula for all substrates
- No lath required for plywood and OSB subfloors.
- Cures fast and develops high early strength for quick installation.
- Can be applied from 1/4″ to 1.5″ (3.8 cm) thick in a single pour.
- Low Prep Formula; Just Sweep, Prime & Pour- no sand blasting required on acceptable surfaces.
- Compatible with most radiant heating systems Replaces the need for cement backerboard.
- Exceeds TCNA and ASTM requirements for ceramic tile and resilient floor covering installations.
- Superior Crack Resistance – Formula reduces shrinkage & minimizes cracks.
- Zero flame spread per ASTM E84 Standard Test Method for Surface Burning Characteristics of Building Materials
